Four new trends in the LED industry


Recently, Guangzhou Lighting Exhibition and related forums were discovered. According to the latest trends, we believe that the fundamentals of the industry are still good, and we have been paying attention to several types of companies for a long time: 1) Sunshine and other application manufacturers that are expected to benefit from the intelligent lighting tide, and controller companies such as Tuobang; 2) Sanan, Dehao, etc. Companies that have made breakthroughs in the field of high-voltage chips and flip-chips; 3) packaging companies that are at the forefront of COB and EMC technologies, such as Hongli, Ruifeng, etc.; 4) Hongli, Ruifeng, Changfang, etc. Integrated packaging company.
Intelligent lighting has become the biggest hot spot at the show. At this exhibition, major brands such as Philips are rushing to launch new smart lighting products. Lighting manufacturers are generally open to Apple Homekit and other platforms, and it is expected that lighting manufacturers and technology giants will be a high probability event. Regarding the connection method, big companies such as Philips have established alliances to push Zigbee.
The potential value of smart lighting is huge. By positioning smart lighting as an Internet portal, companies will provide more high value-added derivative services, and the industry ecology will be greatly changed. At the same time, creating a better light environment is also one of the purposes of intelligent lighting. In the future, the light environment can be reshaped according to people's needs, thus closely integrating with health care.
High voltage and flip chip are still hot spots in the market. The high-voltage chip new products of this exhibition are more mature and mature than in the past, and the downstream acceptance has improved. Flip chips are expected to replace traditional dressing chips in high power and partial backlight applications. We believe that flip chip will not be widely promoted in the short term, but it needs to continue to pay attention to its changes in the long-term pattern of the industry. It is recommended to pay attention to the leading chip manufacturers such as Sanan and Dehao.
COB and EMC packaging are more mainstream. And in the most common mid-power market, the two forms of packaging have gradually consolidated their position. We believe that COB module packaging and EMC packaging cater to the mainstream lighting application trends, and it is recommended to actively focus on the leading packaging manufacturers, such as Ruifeng, Hongli and so on. In addition, the trend of package-free is also the subject of intense discussion by all parties in this exhibition.